ジャンル検索条件:理工学-電気電子工学-半導体デバイス製造技術
21. | RF and Microwave Microelectronics Packaging II 1st ed. 2017 H XII, 172 p. 127 illus., 77 illus. in color. 17 978-3-319-51696-7Springer International Publishing(2017/03)
|
|
22. | Nanoelectronics(Devices, Circuits, and Systems) H 350 p. 17 978-1-4398-7468-4CRC Press(2017/02)
|
|
23. | Cost Analysis Of Electronic Systems (Second Edition), 2nd Updated and Expanded ed. '16 978-981-3148-25-3World Scientific Publishing Co., Pte. Ltd.(2016/12)
|
|
24. | Materials and Processes for Next Generation Lithography(Frontiers of Nanoscience Vol.11) H 634 p. 16 978-0-08-100354-1Elsevier US(2016/12)
|
|
25. | Multiphoton Lithography:Techniques, Materials and Applications '16 978-3-527-33717-0Wiley-VCH Verlag GmbH(2016/11)
|
|
26. | Semiconductor Nanocrystals and Metal Nanoparticles(Advances in Materials Science and Engineering) hardcover 400 p. '16 978-1-4398-7830-9CRC Press(2016/08)
|
|
27. | Signal Integrity 1st ed. 2016 H 260 p. 16 978-3-319-29756-9Springer International Publishing(2016/04)
|
|
28. | Boolean Circuit Rewiring H 232 p. 16 978-1-118-75011-7Wiley-Blackwell(2016/03)
|
|
29. | Microfluidic Very Large Scale Integration (VLSI) 1st ed. 2016 H XV, 270 p. 148 illus., 47 illus. in color. 16 978-3-319-29597-8Springer International Publishing(2016/02)
|
|
30. | Semiconductor TeraHertz Technology(Wiley – IEEE) H 408 p. 15 978-1-118-92042-8Wiley-Blackwell(2015/09)
|