ジャンル検索条件:理工学-電気電子工学-半導体デバイス製造技術
11. | Heterogeneous Integrations hardcover XXII, 368 p. 19 978-981-1372-23-0Springer Singapore(2019/04)
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12. | Systems-Level Packaging for Millimeter-Wave Transceivers (Smart Sensors, Measurement and Instrumentation, Vol. 34) '19 978-3-030-14689-4Springer International Publishing(2019/04)
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13. | Advances in Embedded and Fan–Out Wafer Level Packaging Technologies H 576 p. 19 978-1-119-31413-4Wiley-Blackwell(2019/03)
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14. | Nanoliquid Processes for Electronic Devices 1st ed. 2019 H XVI, 590 p. 432 illus., 302 illus. in color. 19 978-981-1329-52-4Springer Singapore(2019/02)
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15. | Advanced Nanoelectronics:Post-Silicon Materials and Devices '18 978-3-527-34358-4Wiley-VCH Verlag GmbH(2018/11)
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16. | Encyclopedia of Thermal Packaging, Set 3 (Encyclopedia Of Thermal Packaging, Vol. 3) 978-981-3239-66-1World Scientific Publishing Co., Pte. Ltd.(2018/10)
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17. | Nanopackaging 2nd ed. H X, 1,134 p. 18 978-3-319-90361-3Springer International Publishing(2018/10)
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18. | Semiconductor Device Design, Materials, Fabrication, And Characterization hardcover 600 p. '15 978-1-118-56767-8Wiley-Blackwell(2018/09)
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19. | Semiconductor Nanotechnology(Nanostructure Science and Technology) hardcover 236 p. 18 978-3-319-91895-2Springer International Publishing(2018/08)
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20. | Managing More-than-Moore Integration Technology Development 978-3-319-92700-8Springer International Publishing(2018/08)
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